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LT-006970 / first seen 2026-08-12 18:30 / last activity 29d ago solid / under-covered

High-Density Chiplet Integration using Face-Down COW Processes with Bumpless Interconnects for Heterogeneous 3D Systems

measurement

heat
3 / 100 (raw 0.1)
velocity
0.0 independent sources per hour
solidity
80 / 100
sources
1 total, 1 independent
domain span
1 domain covered it

primary source

title
High-Density Chiplet Integration using Face-Down COW Processes with Bumpless Interconnects for Heterogeneous 3D Systems
venue
status
peer-reviewed
doi
10.1109/vlsitechnologyandcir65830.2026.11577472
published
2026-06-14

media coverage / 1 outlets